hexafluoroethane
hexafluoroethane
CAS: 76-16-4
Molecular Formula: C2F6
hexafluoroethane - Names and Identifiers
| Name | hexafluoroethane |
| Synonyms | r116 R-116 R 116 PFC116 freon116 Hexafluorethan perfluoroethane hexafluoroethane hexafluoro-ethan Perfluorocarbon116 FC-116~Perfluoroethane |
| CAS | 76-16-4 |
| EINECS | 200-939-8 |
| InChI | InChI=1/C2F6/c3-1(4,5)2(6,7)8 |
| InChIKey | WMIYKQLTONQJES-UHFFFAOYSA-N |
hexafluoroethane - Physico-chemical Properties
| Molecular Formula | C2F6 |
| Molar Mass | 138.01 |
| Density | 1,607 g/cm3 |
| Melting Point | −100°C(lit.) |
| Boling Point | −78°C(lit.) |
| Vapor Presure | 430 psi ( 21 °C) |
| Vapor Density | 4.7 (vs air) |
| Refractive Index | 1.2060 |
| Physical and Chemical Properties | Hexafluoroethane chemical formula C2F6, purity> 99.7%, colorless, odorless, tasteless, non-flammable inert gas. Slightly soluble in water, melting point -100.6 ℃, boiling point -78 ℃, liquid density 1.60g/ml. |
hexafluoroethane - Risk and Safety
| Hazard Symbols | Xi - Irritant |
| Safety Description | 38 - In case of insufficient ventilation, wear suitable respiratory equipment. |
| UN IDs | UN 2193 2.2 |
| WGK Germany | 3 |
| RTECS | KI4110000 |
| TSCA | T |
| Hazard Note | Irritant |
| Hazard Class | 2.2 |
hexafluoroethane - Nature
Open Data Verified Data
colorless, non-flammable, insoluble in water, soluble in ethanol. The critical temperature of 19.7 deg C, at room temperature (19.7 deg C) is compressed gas. Chemical properties are not active, below 600 deg C and quartz does not react, not all decomposition at 842 deg C. When combusted with a combustible gas, the decomposition produces toxic fluoride. In case of high fever, the internal pressure of the container increases, and there is a risk of cracking and explosion.
Last Update：2025-06-10 22:55:16
hexafluoroethane - Preparation Method
Open Data Verified Data
using activated carbon and fluorine as raw materials, high-concentration fluorine gas was slowly introduced into the reaction furnace containing activated carbon, and the reaction temperature was controlled by controlling electric heating, feeding rate of fluorine and cooling the reaction furnace. After dust removal, alkali washing and dehydration of the reaction product, the crude product containing CF4, C2 F6 and C3 F8 can be obtained, and then the crude mixture is subjected to batch low-temperature distillation to extract C2 F6, the purity of more than 99 can be obtained by further low temperature adsorption dehydration with molecular sieve. 7% of the C2 F6.
Last Update：2025-06-10 22:55:16
hexafluoroethane - Application
Open Data Verified Data
used in the microelectronics industry for plasma etching gas and device surface cleaning, optical fiber production, low temperature refrigeration.
Last Update：2025-08-19 16:24:40
hexafluoroethane - Safety
Open Data Verified Data
rats inhaled 80%(20% 02) x 4H, approximate lethal concentration. This product can cause rapid asphyxia. Post-exposure causes Head Pain, Nausea, and dizziness. It can be regarded as a non-toxic gas, but when burned together with a combustible gas, it decomposes to produce toxic fluoride. When poisoning is found, the victim should be immediately transferred to a pollution-free area and given artificial respiration if necessary. Store in a cool, ventilated warehouse. Keep away from fire and heat source. Moisture-proof, sunscreen. Should be stored separately from flammable and combustible materials.
Last Update：2022-01-01 09:31:22
hexafluoroethane - Reference Information
| EPA chemical substance information | information provided by: ofmpeb.epa.gov (external link) |
| Introduction | Hexafluoroethane is used in the microelectronics industry for plasma etching and surface cleaning. Hexafluoroethane has been a sample from Kanto Denak and two other Japanese companies. Kanto Denka kogino plans to industrialize the production of hexafluoroethane on a large scale in the next fiscal year as a next-generation clean gas for high concentration semiconductor production. Hexafluoroethane has attracted increasing attention as an ultra-fine cleaning gas for semiconductor oxide films, and was used for production since the 2001. In the case of the octafluorobutane used previously as an etchant, the octafluorobutane does not perform etching when it is in contact with an element having a pore diameter of 140 nm or less. |
| Application | The ODP value of hexafluoroethane (ozone depletion potential) is zero, and the GWP value (greenhouse effect capacity) is 9200. It is mainly used in cryogenic refrigeration and electronic cleaning and etching industries, and a small number of applications in medical surgery and other newly developed fields. The ODP value (ozone depletion potential) of hexafluoroethane was zero, and the GWP value (greenhouse effect capacity) was 9200. It is mainly used in cryogenic refrigeration and electronic cleaning and etching industries, and a small number of applications in medical surgery and other newly developed fields. |
| preparation | fluorine gas or a mixture of nitrogen and fluorine gas, tetrafluoroethylene from different feed port into the temperature of l0-60 ℃, in the reactor with the pressure of 0.1~0.15 MPa, the space velocity of the gas in the reactor is controlled to be 0.2-10min, part of the reaction products obtained at the outlet end of the reactor are cyclically returned to the inlet end of the reactor through the centrifugal fan of the external circulation equipment of the reactor, after mixing with fluorine gas or a mixed gas of nitrogen and fluorine gas and tetrafluoroethylene coming in through the feed port, it enters the reactor and circulates the reaction; Another part of the obtained reaction product comes out directly from the discharge port to obtain the hexafluoroethane. The method of the present invention has the advantages of simple process, mild reaction conditions and low cost of the reactor; The prepared hexafluoroethane has high content, low impurity content and high yield. |
| production method | with activated carbon and fluorine as raw materials, high concentration fluorine gas is slowly introduced into the reaction furnace with activated carbon, and electric heating is controlled, the reaction temperature was controlled by feeding the fluorine rate and cooling the reaction furnace. After dust removal, alkali washing and dehydration of the reaction product, the crude product containing CF4, C2F6 and C3F8 can be obtained, and then the crude mixture is subjected to intermittent low-temperature distillation to extract C2F6, the C2F6 with a purity of more than 99.7% can be obtained by further low temperature adsorption dehydration with molecular sieve. |
| category | compressed and liquefied gases |
| toxicity grade | low toxicity |
| Acute toxicity | inhalation-rat LC: 20000 PPM/2 h |
| storage and transportation characteristics | The warehouse is ventilated and dried at low temperature; It is stored separately from flammable materials |
| extinguishing agent | Water |
| toxic substance data | information provided by: pubchem.ncbi.nlm.nih.gov (external link) |
Last Update：2024-04-10 22:29:15
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View History
hexafluoroethane
Butyl dipropasol solvent
ZIRCONIUM ACETATE
A-(METHYLTHIO)ACETAMIDE
Copper(I) cyanide
97-93-8
3-Bromo-4-fluorophenol
Butyl dipropasol solvent
ZIRCONIUM ACETATE
A-(METHYLTHIO)ACETAMIDE
Copper(I) cyanide
97-93-8
3-Bromo-4-fluorophenol