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25617-97-4

Gallium nitride

CAS: 25617-97-4

Molecular Formula: GaN

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25617-97-4 - Names and Identifiers

Name Gallium nitride
Synonyms Gallium nitride
galliummononitride
azanylidynegallane
galliumnitride(gan)
CAS 25617-97-4
EINECS 247-129-0
InChIKey JMASRVWKEDWRBT-UHFFFAOYSA-N

25617-97-4 - Physico-chemical Properties

Molecular FormulaGaN
Molar Mass83.73
Density6.1
Melting Point800 °C (lit.)
Boling Pointdecomposes at >600℃ [KIR78]
Water SolubilitySlightly soluble in hot concentrated sulfuric acid and hot conc. sodium hydroxide. Insoluble in water and dilute acids.
Solubility Insoluble in water, dilute acids. Slightly soluble in hot conc. H2SO4
AppearanceMorphology Powder
ColorYellow
Merck14,4351
Storage ConditionRoom Temprature
StabilityStability Store under dry argon. Water and moisture sensitive. Incompatible with strong oxidizing agents.
SensitiveMoisture Sensitive
Refractive Index2.70 (27℃)
MDLMFCD00016108

25617-97-4 - Risk and Safety

Safety DescriptionS22 - Do not breathe dust.
S24/25 - Avoid contact with skin and eyes.
WGK Germany3
RTECSLW9640000
FLUKA BRAND F CODES10-21
TSCAYes

25617-97-4 - Uses and synthesis methods

Third generation semiconductor materials

The third generation semiconductor materials are represented by gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), and diamond. They are the main materials in the 5G era. Among them, gallium nitride (GaN) and silicon carbide (SiC) have the largest market and development space.

As a third-generation semiconductor material, gallium nitride has a higher band gap. It is the material system with the highest theoretical electro-optical and photoelectric conversion efficiency so far. Downstream applications include microwave radio frequency devices (communication base stations, etc.), power electronics Devices (power supplies, etc.), optoelectronic devices (LED lighting, etc.). However, in the third-generation semiconductor materials, due to the limitation of technology and process level, gallium nitride materials are still facing challenges to achieve large-scale applications as substrates. Its applications are mainly based on sapphire, silicon wafers or silicon carbide wafers. Gallium nitride is grown by epitaxy to manufacture gallium nitride devices.

In fact, gallium nitride (GaN) technology is not a new semiconductor technology. It has been frequently used in light-emitting diodes since 1990, but it is expensive. In terms of manufacturing process, gallium nitride is not liquid, and it is not possible to use the traditional Czochralski method of single crystal silicon production process to pull out single crystals. It needs to be synthesized purely by gas reaction, and the properties of nitrogen are very stable, and gallium is a very rare metal (Gallium is an associated ore, and no concentrated gallium ore is formed. It is mainly extracted from bauxite, and the cost is relatively high), and the reaction time is long, the speed is slow, and the reaction produces many by-products. The production of gallium nitride is demanding on equipment, the technology is complex, the production capacity is extremely low, and the superposition of many factors makes the gallium nitride single crystal material very expensive.

category

Toxic substances

Toxicity classification

low toxicity

Acute toxicity

oral-mouse LDL0: 10000 mg/kg; Abdominal cavity-mouse LDL0: 5000 mg/kg

storage and transportation features

Warehouse ventilation low temperature drying

Fire extinguishing agent

Dry powder, foam, sand, carbon dioxide, mist water

Last Update:2024-04-10 22:29:15

25617-97-4 - Nature

crystal structure Hexagonal, Wurtzite (Zincite) Structure - Space Group P 63mc
EPA chemical information Gallium nitride (GaN) (25617-97-4)
Last Update:2024-04-10 22:29:15
25617-97-4
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