Name | POLYIMIDE RESIN |
Synonyms | Polyimides POLYIMIDERESIN Polyimideresins POLYIMIDE RESIN -2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1h-inden-5-amine 3-isobenzofurandione,5,5'-carbonylbis-polymerwith1(or3)-(4-aminophenyl) 1,3-Isobenzofurandione,5,5-carbonylbis-,polymerwith1(or3)-(4-aminophenyl)-2,3-dihydro-1,3,3(or1,1,3)-trimethyl-1H-inden-5-amine |
CAS | 62929-02-6 |
EINECS | 214-686-6 |
Molecular Formula | C35H28N2O7 |
Molar Mass | 588.606 |
Density | 1.2 |
Melting Point | >300°C |
Flash Point | >93°(199°F) |
Water Solubility | Insoluble in water. |
Storage Condition | Room Temprature |
MDL | MFCD01868102 |
Li Min , Zhang , zhongweihong , pan Junshan
Abstract:
polyimide resin is a kind of polymer material with high heat resistance, excellent dielectric properties and good mechanical strength. In this paper, the research and application progress of polyimide resin in recent years are mainly introduced. The method includes: introducing characteristic elements or groups by a new synthesis method to prepare a new type of polyimide resin with excellent performance or certain characteristic function; Application progress of polyimide resin in composite materials; application progress of polyimide resin in microelectronics industry, and the development direction of polyimide resin is put forward.
Key words:
composite material Microelectronics apply polyimide resin synthesis
DOI:
10.3321/j.issn:1000-3851.2000.04.010
cited:
year:
2000
Yang Shiyong , high strength , Hu Aijun , Li Jiaze , Xu Yingli
Abstract:
The Research progress of high temperature resistant polyimide Matrix Resins and carbon fiber composites are reviewed. The Matrix Resins include PMR type thermosetting polyimides with 316 ℃ resistance, such as PMR- 15,KH- 30 4, etc, and 371 °c resistant polyimide matrix resin such as PMR-II -50,AFR-70 OB, V-CAP- 50,V-CAP- 75,KH- 30 5, etc. Introduced their chemical synthesis, structure, physical and chemical properties and the relationship between structure and properties, the applications in the field of aviation and space technology are briefly introduced.
Key words:
polyimide high temperature resistant composite material carbon fiber
DOI:
JournalArticle/5aedee76c095d710d410608b
cited:
year:
2000
King Liu , he Minhui Fan Lin , Yang Shiyong
Abstract:
The application and development of polyimide (PI) in integrated circuit fabrication and Advanced Electronic Packaging are reviewed. The basic theory, development status and future development trend of polyimide packaging materials are described in detail. The application of ZKPI series polyimide packaging materials in chip surface passivation, interlayer dielectric insulating layer film and stress buffer coating is mainly discussed.Key words:
polyimide Advanced Electronics Package interlayer dielectric insulating film
DOI:
10.3969/j.issn.1003-353X.2003.10.012
cited:
year:
2003