Molecular Formula | Au |
Molar Mass | 196.97 |
Density | 19.3 g/mL at 25 °C (lit.) |
Melting Point | 1063 °C (lit.) |
Boling Point | 2808 °C (lit.) |
Flash Point | 4°C |
Water Solubility | Soluble in hot sulfuric acid and aqua regia. Insoluble in water and acid. |
Solubility | H2O: soluble |
Appearance | wire |
Specific Gravity | 19.3 |
Color | purple |
Exposure Limit | NIOSH: IDLH 25 mg/m3 |
Merck | 13,4529 |
PH | 6-8 |
Storage Condition | 2-8°C |
Stability | Stable. May react with halogens, strong oxidizing agents, ammonia, hydrogen peroxide. Reaction with ammonia or hydrogen peroxide may form explosive materials. |
Sensitive | Light Sensitive |
Refractive Index | n20/589.3 1.523 |
MDL | MFCD00003436 |
Physical and Chemical Properties | Copper and zinc powder is coated with surface treatment agent of copper-zinc alloy flake powder, there are a variety of different colors, can be divided into three kinds of cyan, cyan and red light. Copper content in the 75% ~ 80% or so is called the cyan copper zinc powder, also known as green gold powder; Copper content in the 84% ~ 86% or so is called the cyan red copper zinc powder, and light gold powder, a pure gold hue; copper content in about 88% known as red copper and zinc powder, also known as red gold powder, red gold. Copper and zinc powder is a scale structure, which determines that it has the characteristics of parallel arrangement with the coating, and can form a continuous metal film, which has a reflective effect on the external light. Copper and zinc powder has floating properties when mixed into the carrier. The particle size distribution of copper and zinc powder is narrow, and the powder with different fineness has different reflective ability and inconsistent hue. In printing, the coarse particles are not easily transferred from the roller to the paper, resulting in the leakage of printing. Therefore, the particle size distribution should be strictly controlled in the production. Easy oxidation discoloration. |
Use | Mainly used in electronic industry thick film slurry, multilayer ceramic capacitor internal and external electrode materials. Used in electronic industry thick film slurry, multilayer ceramic capacitor internal and external electrode materials. |
Risk Codes | R36/38 - Irritating to eyes and skin. R43 - May cause sensitization by skin contact R67 - Vapors may cause drowsiness and dizziness R65 - Harmful: May cause lung damage if swallowed R63 - Possible risk of harm to the unborn child R48/20 - R38 - Irritating to the skin R11 - Highly Flammable R34 - Causes burns R23 - Toxic by inhalation R52/53 - Harmful to aquatic organisms, may cause long-term adverse effects in the aquatic environment. |
Safety Description | S26 - In case of contact with eyes, rinse immediately with plenty of water and seek medical advice. S36/37/39 - Wear suitable protective clothing, gloves and eye/face protection. S45 - In case of accident or if you feel unwell, seek medical advice immediately (show the label whenever possible.) S62 - If swallowed, do not induce vomitting; seek medical advice immediately and show this container or label. S36/37 - Wear suitable protective clothing and gloves. S61 - Avoid release to the environment. Refer to special instructions / safety data sheets. S23 - Do not breathe vapour. |
UN IDs | UN 1789 8/PG 3 |
WGK Germany | 3 |
RTECS | MD5420000 |
TSCA | Yes |
HS Code | 3822 00 00 |
Hazard Class | 6.1 |
Packing Group | II |
Downstream Products | potassium tetrakis(cyano-C)aurate gold trichloride |
golden yellow, metallic luster, face-centered cubic crystal. Melting point 1064. 76 ° C; Boiling point 2700 ° C; Relative density 19.3 I Mohs hardness 2.5 ~ 3.0l Brinell hardness 18.5. Soluble in aqua regia, potassium cyanide, insoluble in water, acid. At room temperature, the surface can be corroded by a halogen solution. Soft and ductile, chemically stable.
A high-purity gold chloride solution was added to the reactor, and oxalic acid was added under stirring for reduction reaction, followed by filtration and washing with ion-free water to obtain high-purity gold.
as the raw material of gold wire and gold plating material required for semiconductor connection.